Wang, EntongBasem, AliHussein, Zahraa AbedSingh, Narinderjit Singh SawaranAl Rawi, OrabiAbdullaeva, BarnoBaghaei, Sh.2025-02-172025-02-17202500735-19331879-017810.1016/j.icheatmasstransfer.2025.1086182-s2.0-85215551851https://doi.org/10.1016/j.icheatmasstransfer.2025.108618https://hdl.handle.net/20.500.14517/7655Welded metals exhibit various mechanical properties influenced by multiple factors, with temperature playing a crucial role. Although research exists on the mechanical behavior of welded materials, gaps remain in understanding how thermal shock affects the performance of Cu-Ag metallic compounds. This study used molecular dynamics simulations to investigate these effects comprehensively. In the present study, mechanical testing conditions were applied to assess key mechanical constants, including Young's modulus and ultimate strength. The findings show that thermal stress significantly affected the mechanical strength of atomic samples, with ultimate strength increasing from 1389.074 MPa at 350 K to 1426.61 MPa at 450 K. However, increasing the temperature to 500 K caused a decrease in ultimate strength to 1412.74 MPa and in Young's modulus to 93.499 GPa. This behavior illustrated how thermal effects can both enhance particle movement and introduce potential weaknesses at higher temperatures. Additionally, interaction energy decreased from -6657.4512 eV to -6613.2486 eV, indicating increased atomic mobility without disrupting atomic arrangements. The mean square displacement results showed a notable increase after reaching 450 K, reflecting improved atomic mobility. Overall, this study provided valuable insights for optimizing mechanical structures through controlled thermal applications in various industrial contexts.eninfo:eu-repo/semantics/closedAccessWelding ProcessThermal ShockMolecular Dynamics SimulationMechanical BehaviorArticleQ1Q1162WOS:001409177800001