An Investigation into the Effects of Various Phase Change Materials on Industrial Electronic Systems' Cooling Rates Through Experimentation Based on a Specific Dimensionless Number

dc.authorscopusid 60080440900
dc.authorscopusid 57422522900
dc.authorscopusid 57808829800
dc.authorscopusid 55437205600
dc.authorscopusid 55871962900
dc.authorscopusid 57858983400
dc.authorscopusid 23028598900
dc.date.accessioned 2025-09-15T18:35:29Z
dc.date.available 2025-09-15T18:35:29Z
dc.date.issued 2025
dc.department Okan University en_US
dc.department-temp [null] null, Organization and Personnel Department, Beihua University, Jilin, China; [Basem] Ali A., Faculty of Engineering, University of Warith Al-Anbiyaa, Karbala, Iraq; [Al-Nussairi] Ahmed Kateb Jumaah, Al-Manara College for Medical Sciences, Amarah, Iraq; [Sawaran Singh] Narinderjit Singh, Faculty of Data Science and Information Technology, INTI International University, Nilai, Malaysia; [Saeidlou] Salman, Technology and Design, Canterbury Christ Church University, Canterbury, United Kingdom; [Al-Khafaji] Mohsin O., Air Conditioning and Refrigeration Techniques Engineering Department, Al-Mustaqbal University, Hillah, Iraq; [Alizade] Morteza, Department of Mechanical Engineering, Islamic Azad University, South Tehran Branch, Tehran, Iran; [Yazdekhasti] Arian, Department of Mechanical Engineering, Isfahan University of Technology, Isfahan, Iran; [Salahshour] Soheil, Faculty of Engineering and Natural Sciences, Istanbul Okan University, Tuzla, Turkey, Faculty of Engineering and Natural Sciences, Bahçeşehir Üniversitesi, Istanbul, Turkey, Research Center of Applied Mathematics, Khazar University, Baku, Azerbaijan; [Baghaei] Sh, Fast Computing Center, Tehran, Iran, Ceramic Engineering Research Center, Iran en_US
dc.description.abstract The development of electronic equipment depends on the performance of their processors, which themselves require operating at low temperatures. So, solutions that can keep their temperatures low are significant for the advancement of this valuable industry. This study attempts to find an effective solution to this problem in a practical case, which is the ASUS GT 730 silent graphics card. The working condition of this processor's heatsink is simulated by a heat source with 1.7- and 2.1-W heat flow rates. To cool down the system, a new experimental setup is proposed, in which the heatsink is placed inside an aluminum box where water flows through a copper pipe. In addition, two phase change materials (PCM), including Lauric Acid and Paraffin wax, with different volume percentages, are separately injected into the box to examine the influence of the properties of these materials on energy storage. Hence, 18 modes are obtained based on heat flux, PCM type, and their volume percentages. To compare the effectiveness, a dimensionless number is introduced as a special measure based on the time duration recorded for each mode, named dimensionless melting time efficiency (DMTE). This number, which adapts to the physics of the process, is defined as the ratio of the total heat input to the total heat capacity of PCM (sensible and latent). This new setup, together with the definition of the dimensionless number, provides an appropriate tool for achieving the best arrangement selection for higher thermal energy absorption. The results show that the presence of phase change materials, regardless of their type, will increase the efficiency of the system. Furthermore, using the maximum volume percentage of the phase change material will maximize the cooling efficiency of the system, where DMTE can be reduced by around 64 % for both PCMS and both input heat flow rates from 25 % volume percentage to full. Also, it is concluded that the choice of Lauric acid as phase material change for this case can enhance the performance of the system, where DMTE of Lauric acid decreases by 6.25 % for an input heat flow rate of 1.7 W and 9.68 % for 2.1 W than paraffin wax when the volume percentage of PCMs is maximum. © 2025 Elsevier B.V., All rights reserved. en_US
dc.identifier.doi 10.1016/j.icheatmasstransfer.2025.109573
dc.identifier.issn 0735-1933
dc.identifier.scopus 2-s2.0-105014741113
dc.identifier.scopusquality Q1
dc.identifier.uri https://doi.org/10.1016/j.icheatmasstransfer.2025.109573
dc.identifier.uri https://hdl.handle.net/20.500.14517/8358
dc.identifier.volume 169 en_US
dc.identifier.wosquality Q1
dc.language.iso en en_US
dc.publisher Elsevier Ltd en_US
dc.relation.ispartof International Communications in Heat and Mass Transfer en_US
dc.relation.publicationcategory Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı en_US
dc.rights info:eu-repo/semantics/closedAccess en_US
dc.subject Dimensionless Melting Time Efficiency en_US
dc.subject Experimentation en_US
dc.subject Industrial Electronic Systems Cooling Rates en_US
dc.subject Phase Change Materials en_US
dc.subject Cooling Systems en_US
dc.subject Electronic Cooling en_US
dc.subject Heat Flux en_US
dc.subject Heat Sinks en_US
dc.subject Melting en_US
dc.subject Oscillators (Electronic) en_US
dc.subject Thermal Management (Electronics) en_US
dc.subject Cooling Rates en_US
dc.subject Dimensionless Melting Time Efficiency en_US
dc.subject Electronics System en_US
dc.subject Experimentation en_US
dc.subject Industrial Electronic System Cooling Rate en_US
dc.subject Melting Time en_US
dc.subject Phase Change en_US
dc.subject System Cooling en_US
dc.subject Time Efficiencies en_US
dc.subject Volume Percentage en_US
dc.subject Phase Change Materials en_US
dc.title An Investigation into the Effects of Various Phase Change Materials on Industrial Electronic Systems' Cooling Rates Through Experimentation Based on a Specific Dimensionless Number en_US
dc.type Article en_US
dspace.entity.type Publication
gdc.coar.access metadata only access
gdc.coar.type text::journal::journal article

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